DocumentCode
1919956
Title
Pin-fin heat sink modeling and characterization
Author
Jung, H.H. ; Maveety, J.G.
Author_Institution
Intel Corp., Santa Clara, CA, USA
fYear
2000
fDate
2000
Firstpage
260
Lastpage
265
Abstract
Numerical experiments were performed to investigate the turbulent fluid flow and heat transfer from three pin-fin heat sink geometries over the range of ReD 7,800 to 19,700 with air impingement cooling. The standard k-ε turbulence model was used in predicting the Reynolds stresses. The predictions of junction-to-ambient thermal resistance compare favorably with available experimental results. The analysis presented here illustrates the effect of fin size and channel spacing on the overall distribution of the issuing fluid within the pin-fins. For large finned arrays, much of the impinging air is deflected laterally away from the heat sink. As a result little of the issuing air is allowed to penetrate the inner channels and cool the heat sink. By contrast, for small finned arrays, most of the impinging air flows away from the array via the centerline channels providing very little air for cooling of the inner fins. This situation also reduces the cooling effectiveness
Keywords
heat sinks; thermal resistance; turbulence; Reynolds number; air impingement cooling; heat transfer; numerical model; pin-fin heat sink; thermal resistance; turbulent fluid flow; Cooling; Fluid flow control; Geometry; Heat sinks; Heat transfer; Microprocessors; Temperature; Thermal management; Thermal resistance; Uncertainty;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location
San Jose, CA
Print_ISBN
0-7803-5916-X
Type
conf
DOI
10.1109/STHERM.2000.837092
Filename
837092
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