Title :
Optimization of parallel plate heatsinks for forced convection
Author_Institution :
Thermal Eng. Syst., Showa Aluminum Corp., Tochigi, Japan
Abstract :
Cooling of processors in servers, workstations and desktop computers has changed to accommodate increasing power, approaching 100 watts. Dedicated fan-duct-heatsink combinations are becoming state-of-the-art for packaging of the processor(s). Extruded heatsinks, standard for many years, require larger space, pressure drop and/or fan/blower power than necessary. In this study, optimum dimensions of fin thickness and pitch are calculated for a variety of realistic operating conditions. These dimensions are somewhat smaller then those achievable by extruded heatsinks
Keywords :
forced convection; heat sinks; 100 W; design optimization; extrusion; fan duct; forced convection; packaging; parallel plate heat sink; processor cooling; Coolants; Cooling; Heat sinks; Heat transfer; Packaging; Surface resistance; Thermal conductivity; Thermal expansion; Thermal factors; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5916-X
DOI :
10.1109/STHERM.2000.837093
