Title :
MEMS high Q microwave inductors using solder surface tension self-assembly
Author :
Dahlmann, G.W. ; Yeatman, E.M. ; Young, P.R. ; Robertson, I.D. ; Lucyszyn, S.
Author_Institution :
Dept. of Electr. & Electron. Eng., Imperial Coll., London, UK
Abstract :
We present microwave inductors of 1.5 to 2.5 nH fabricated out-of-plane by a self-assembly process. The consequent de-coupling from the substrate allows improved Q (from 4 to 20) and frequency of maximum Q (from 0.5 GHz to 3 GHz) on low resistivity silicon substrates.
Keywords :
Q-factor; inductors; micromechanical devices; microwave devices; self-assembly; soldering; surface tension; 0.5 to 3 GHz; MEMS microwave inductor; Q-factor; Si; de-coupling; out-of-plane fabrication; silicon substrate; solder surface tension self-assembly; Assembly; Coils; Dielectric substrates; Fabrication; Fasteners; Inductors; Micromechanical devices; Self-assembly; Spirals; Surface tension;
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6538-0
DOI :
10.1109/MWSYM.2001.966899
