DocumentCode :
1920581
Title :
Stability of Copper Film Elements at the Influence of Power Electromagnetic Fields
Author :
Taran, Ye.P. ; Starostenko, V.V. ; Gribs, Kiy M. ; Grygoriev, Ye.V.
Author_Institution :
Tavrida Nat. Univ., Simferopol
fYear :
2007
fDate :
10-14 Sept. 2007
Firstpage :
663
Lastpage :
664
Abstract :
Presented in this paper is numerical calculation of degradation processes in copper film elements at the influence of power electromagnetic fields. Character of thermal processes in non-uniform copper conducting films is established.
Keywords :
conducting materials; copper; electromagnetic fields; numerical analysis; copper film elements; degradation processes; nonuniform copper conducting films; power electromagnetic fields; thermal processes; Conductive films; Copper; Electromagnetic fields; Lattices; Publishing; Semiconductor films; Silicon; Stability; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave & Telecommunication Technology, 2007. CriMiCo 2007. 17th International Crimean Conference
Conference_Location :
Crimea
Print_ISBN :
978-966-335-012-7
Type :
conf
DOI :
10.1109/CRMICO.2007.4368893
Filename :
4368893
Link To Document :
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