DocumentCode
1920915
Title
7.1: A microsystems enabled field desorption source
Author
Resnick, Paul J. ; Holland, Christopher E. ; Schwoebel, Paul R. ; Hertz, Kristin L. ; Chichester, David L.
Author_Institution
Sandia Nat. Labs., Albuquerque, NM, USA
fYear
2010
fDate
26-30 July 2010
Firstpage
104
Lastpage
105
Abstract
Technologies that have been developed for microelectromechanical systems (MEMS) have been applied to the fabrication of field desorption arrays. These techniques include the use of thick films for enhanced dielectric stand-off, as well as an integrated gate electrode. The increased complexity of MEMS fabrication provides enhanced design flexibility over traditional methods.
Keywords
desorption; micromechanical devices; thick films; dielectric stand-; field desorption arrays; integrated gate electrode; microelectromechanical systems; thick films; Dielectrics; Electrodes; Fabrication; Logic gates; Silicon; Substrates; MEMS; arrays; field desorption; silicon tips;
fLanguage
English
Publisher
ieee
Conference_Titel
Vacuum Nanoelectronics Conference (IVNC), 2010 23rd International
Conference_Location
Palo Alto, CA
Print_ISBN
978-1-4244-7889-7
Electronic_ISBN
978-1-4244-7888-0
Type
conf
DOI
10.1109/IVNC.2010.5563205
Filename
5563205
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