DocumentCode :
1921033
Title :
TLP: ESD models correlation and aproximation
Author :
Zola, Julio Guillermo ; Pacheco, Gonzalo Andrè
Author_Institution :
Electron. Dept., Univ. of Buenos Aires, Buenos Aires, Argentina
fYear :
2009
fDate :
1-2 Oct. 2009
Firstpage :
93
Lastpage :
97
Abstract :
There are several models which try to describe the waveforms and damage produced by an electrostatic discharge event -ESD- to an integrated circuit-IC-, or more generally to a semiconductor device-SD-. The transmission line pulse-TLP-test is widely used to run tests in this field, so it is needed to keep close correlation to the models used in different standards, in order to validate its results. This work analyzes the search of an approximate correlation, through tests, measurements and PSpice simulation, in order to predict, through the use of TLP information, the results of applying different standard ESD waveforms to a device under test-DUT-.
Keywords :
SPICE; electrostatic discharge; integrated circuit testing; semiconductor technology; ESD models correlation; PSpice simulation; TLP; electrostatic discharge; integrated circuit; semiconductor device; transmission line pulse test;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro-Nanoelectronics, Technology and Applications, 2009. EAMTA 2009. Argentine School of
Conference_Location :
San Carlos de Bariloche
Print_ISBN :
978-1-4244-4835-7
Electronic_ISBN :
978-9-8725-1029-9
Type :
conf
Filename :
5288892
Link To Document :
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