DocumentCode :
1921372
Title :
Single-Wafer, SiGe Heterostructures Grown by Cold Wall UHV-CVD: Application to Hetero-Junction Bipolar Transistor (HBT) Fabrication
Author :
Glowacki, F. ; Campidelli, Y. ; Garchery, L. ; Gruhle, A.
Author_Institution :
France Telecom, CNET-CNS, BP 98, 38243, Meylan-Cedex, France.
fYear :
1994
fDate :
11-15 Sept. 1994
Firstpage :
745
Lastpage :
748
Abstract :
HBT layers have been fabricated using a multi-step process in a single run. They were made in a new, single-wafer, 200 mm compatible, cold wall UHV-CVD reactor [1]. Preliminary electrical measurements on fabricated transistors demonstrate excellent control of layers thickness and doping transitions which allows to compare these HBT layers with those fabricated by MBE [2] or hot-wall UHV-CVD [3].
Keywords :
Bipolar transistors; Doping; Electric variables measurement; Fabrication; Germanium silicon alloys; Heterojunction bipolar transistors; Inductors; Silicon germanium; Thickness control; Thickness measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
Conference_Location :
Edinburgh, Scotland
Print_ISBN :
0863321579
Type :
conf
Filename :
5435823
Link To Document :
بازگشت