• DocumentCode
    1921492
  • Title

    Modeling of RLC interconnect delay for ramp input using diffusion model approach

  • Author

    Kar, Rajib ; Maheshwari, Vikas ; Agarwal, Vasundhara ; Mal, Ashis Kumar ; Bhattacharjee, Anup

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol., Durgapur, India
  • fYear
    2010
  • fDate
    3-5 Oct. 2010
  • Firstpage
    436
  • Lastpage
    440
  • Abstract
    In this paper, we begin with the analysis of signal delay through an ideal RLC transmission line, without the driver and the load impedance. This yield´s to the transform voltage and current equations governing the system response by incorporating appropriate boundary conditions for interconnect delay analysis. Two port parameters, in terms of ABCD matrix, are obtained. Further we considered a practical transmission line with driver and load to find out the relation between the transform input and output voltage response in s-domain. The relation thus obtained is applied to ramp input system and the transient response for it, in time domain, is obtained using inverse Laplace transform. Our main objective is to find the shape function of a wire which minimizes delay for RLC circuit using diffusion model approach. Although the problem has been studied under the Elmore delay model, it is only a rough estimate of the actual delay and more accurate estimation of the actual delay should be used to determine the wire shape function. The use of transmission line model in our study gives a very accurate estimate of the actual delay. Previous studies under Elmore delay model suggest that exponential wire shape function to be of the form f((x)=ae-ba). By solving the diffusion equation, we derive the transient response in the time domain as a function of a and b for ramp input. The coefficients a and b are determined so that the actual (50% delay) is minimized.
  • Keywords
    Laplace transforms; RLC circuits; delay circuits; integrated circuit interconnections; matrix algebra; transmission lines; ABCD matrix; RLC circuit; RLC interconnect delay; RLC transmission line; diffusion model approach; inverse Laplace transform; ramp input; signal delay; Delay; Equations; Integrated circuit interconnections; Integrated circuit modeling; Mathematical model; Power transmission lines; Wire; Delay Calculation; Distributed RLC line; Interconnect; Transient Response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics & Applications (ISIEA), 2010 IEEE Symposium on
  • Conference_Location
    Penang
  • Print_ISBN
    978-1-4244-7645-9
  • Type

    conf

  • DOI
    10.1109/ISIEA.2010.5679425
  • Filename
    5679425