• DocumentCode
    1922042
  • Title

    Heat transfer of closed flat-plat loop pulsating heat pipe in start-up stage

  • Author

    Wu, Qingping ; Xu, Rongji ; Zhang, Hua ; Li, Yanzhong

  • Author_Institution
    Sch. of Energy & Power Eng., Xi´´an Jiaotong Univ., Xi´´an, China
  • Volume
    1
  • fYear
    2011
  • fDate
    20-22 May 2011
  • Firstpage
    864
  • Lastpage
    868
  • Abstract
    In this paper, the heat transfer process of flat-plate closed loop pulsating heat pipe (FCLPHP) in start-up stage was analyzed. The process of heat transfer of FCLPHP was simplified to two categories: the heat transfer due to the pulsating effect of working fluid and the heat transfer due to the heat conduction through the aluminum flat-plate of FCLPHP. After analyzing the flow pattern of working fluid observed in our visual experiment, we found that the heat transfer due to the pulsating effect of working fluid can be treated as the enhanced heat conduction in start-up stage. By combining two heat conduction processes together with the equivalent thermal diffusivity, we developed a non-steady heat conduction model of FCLPHP. Control volume method was applied to solve the governing equations in the model. The calculated results were compared with the experimental data. The agreement between them shows that the model can accurately describe the heat transfer process of FCLPHP in start-up stage.
  • Keywords
    closed loop systems; heat conduction; heat pipes; pattern formation; plates (structures); pulsatile flow; thermal diffusivity; aluminum flat-plate; control volume method; flat-plate closed loop pulsating heat pipe; flow pattern; heat transfer; nonsteady heat conduction model; start-up stage; thermal diffusivity; working fluid pulsating effect; Heating; Surface treatment; non-steady heat transfer model; pulsating heat pipe; start up stage; thermal performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Renewable Energy & Environment (ICMREE), 2011 International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-61284-749-8
  • Type

    conf

  • DOI
    10.1109/ICMREE.2011.5930941
  • Filename
    5930941