Through-Wafer Copper Electroplating for RF Silicon Technology

Author

Nguyen, N.T. ; Ng, K.T. ; Boellaard, E. ; Pham, N.P. ; Craciun, G. ; Sarro, P.M. ; Burghartz, J.N.

Author_Institution

Semiconductor Technology Researcher, Hanoi, Vietnam

fYear

2002

fDate

24-26 September 2002

Firstpage

255

Lastpage

258

Keywords

Biomembranes; Copper; Electronic components; Laboratories; Lithography; Metallization; Micromachining; Radio frequency; Silicon; Wet etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research Conference, 2002. Proceeding of the 32nd European

Print_ISBN

88-900847-8-2

Type

DOI

10.1109/ESSDERC.2002.194918

Filename

1503848

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