• DocumentCode
    1922164
  • Title

    Using RSM Techniques to Contour Plot Response Distributions of Semiconductor Processes

  • Author

    Walton, A.J. ; Fallon, M. ; Newsam, M.I. ; Ferguson, R.S. ; Sprevak, D.

  • Author_Institution
    Dept Elect Eng, Kings Buildings, University of Edinburgh, Edinburgh,EH9 3JL, UK
  • fYear
    1994
  • fDate
    11-15 Sept. 1994
  • Firstpage
    829
  • Lastpage
    832
  • Abstract
    This paper presents a method that can be used as part of a Design For Manufacturability (DFM) procedure. The equations that form the response surfaces are used to obtain distribution parameters and this data is used to create response surfaces of the distributions. This then enables the process designer to choose the optimum processing conditions and set realistic specifications on the process parameters.
  • Keywords
    Buildings; Design for manufacture; Equations; Manufacturing processes; Optimization methods; Process design; Response surface methodology; Robustness; Semiconductor device manufacture; US Department of Energy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1994. ESSDERC '94. 24th European
  • Conference_Location
    Edinburgh, Scotland
  • Print_ISBN
    0863321579
  • Type

    conf

  • Filename
    5435850
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1922164