• DocumentCode
    1922582
  • Title

    Chemically prepared Pb(Zr,Ti)O3 thin films: the effects of orientation and stress

  • Author

    Tuttle, B.A. ; Voigt, James A. ; Garino, Terry J. ; Goodnow, David C. ; Schwartz, Robert W. ; Lamppa, Diana L. ; Headley, Thomas J. ; Eatough, Michael O.

  • Author_Institution
    Sandia Nat. Labs, Albuquerque, NM, USA
  • fYear
    1992
  • fDate
    30 Aug-2 Sep 1992
  • Firstpage
    344
  • Lastpage
    348
  • Abstract
    The effects of orientation and stress on chemically prepared Pb(Zr,Ti)O3 (PZT) film properties have been determined. Systematic modification of the underlying substrate technology has made it possible to fabricate suites of films that have various degrees of orientation at a constant stress level, and to fabricate films that are in different states of stress but have similar orientation. Highly oriented films of the following compositions have been fabricated: PZT 60/40, PZT 40/60, and PZT 20/80. Remanent polarizations (≈60 μC/cm 2) greater than those of the best bulk polycrystalline ferroelectrics were obtained for PZT 40/60 films that were under compression and highly (001) oriented. Systematically varying orientation influenced ferroelectric properties, and the film stress also had a considerable effect. The sign of the film stress at the Curie point controlled the type of ferroelectric behavior exhibited by the films. Stress measurements as a function of thermal history indicated that the coefficient of thermal expansion of the paraelectric state was critical in determining the type of film ferroelectric behavior
  • Keywords
    X-ray diffraction examination of materials; ceramics; dielectric hysteresis; ferroelectric Curie temperature; ferroelectric thin films; lead compounds; thermal expansion; Curie point; PZT thin films; PbZrO3TiO3; X-ray diffraction; crystallite orientation; dielectric hysteresis; film stress; paraelectric state; polycrystalline ferroelectrics; remanent polarization; solution chemistry fabrication; substrate technology; thermal expansion; Chemical technology; Ferroelectric films; Ferroelectric materials; History; Polarization; Stress control; Stress measurement; Substrates; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1992. ISAF '92., Proceedings of the Eighth IEEE International Symposium on
  • Conference_Location
    Greenville, SC
  • Print_ISBN
    0-7803-0465-9
  • Type

    conf

  • DOI
    10.1109/ISAF.1992.300703
  • Filename
    300703