DocumentCode
1923417
Title
Electrical and Thermal Local Effects Simulation for Electromigration
Author
Borgarino, M. ; Castagnini, A. ; De Munari, I. ; Fantini, F.
Author_Institution
Dipartimento di Ingegneria dell´´Informazionie, UniversitÃ\xa0 di Parma, Viale delle Scienze, 43100 Parina, Italy
fYear
1996
fDate
9-11 Sept. 1996
Firstpage
921
Lastpage
924
Abstract
This work reports on the results obtained from numerical simulations of cturrent density, temperature and temperature gradient distributions along test strtuctures designed for the evaluation of electromigration. In partictular, the thermal flux crowding effect and the conditions under which a temperature gradient peak builds up are reported. The influeilce of the bending radius of the structure is also taken into account.
Keywords
Boundary conditions; Current density; Electromigration; Heat sinks; Laplace equations; Numerical simulation; Resistance heating; Temperature distribution; Testing; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Conference_Location
Bologna, Italy
Print_ISBN
286332196X
Type
conf
Filename
5435917
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