DocumentCode :
1923820
Title :
Low Cost Flip Chip Technology
Author :
De Langen, Michael T W
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
67
Lastpage :
71
Keywords :
Assembly; Costs; Flip chip; Packaging; Personal digital assistants; Printed circuits; Silicon; Soldering equipment; Surface-mount technology; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618980
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1923820
