• DocumentCode
    1923884
  • Title

    Development of high accuracy wafer thinning and pickup technology for thin wafer(die)

  • Author

    Miyazaki, Chuichi ; Shimamoto, Haruo ; Uematsu, Toshihide ; Abe, Yoshiyuki ; Kitaichi, Kosuke ; Morifuji, Tadahiro ; Yasunaga, Shoji

  • fYear
    2010
  • fDate
    24-26 Aug. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Accurate wafer thinning and picking up die technology around 10μm thickness were evaluated. We obtained the prospect that thickness accuracy 10±1μm which is the target of the ultra thin grinding, by applying new technology like Non-contact gauge or Auto TTV. For picking up the ultra thin dies, we found the best tool design rule and some machine condition in slider peel method.
  • Keywords
    three-dimensional integrated circuits; wafer bonding; wafer level packaging; high accuracy wafer thinning; pickup technology; slider peel method; thin wafer; ultra thin dies; Accuracy; Glass; Heating; Substrates; Thickness measurement; Wheels;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan, 2010 IEEE
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4244-7593-3
  • Type

    conf

  • DOI
    10.1109/CPMTSYMPJ.2010.5679528
  • Filename
    5679528
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1923884