DocumentCode :
1923916
Title :
Polymer Flip Chip "Process And Reliability Considerations"
Author :
Estes, Richard H.
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
92
Lastpage :
100
Keywords :
Assembly; Bonding; Costs; Flip chip; Integrated circuit interconnections; Manufacturing; Polymers; Semiconductor device packaging; Space technology; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
618985
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1923916
