DocumentCode :
1924562
Title :
Electromigration Failure in Thin Film Conductors a perspective
Author :
Lloyd, J.R.
Author_Institution :
Lloyd and Thompson Associates, Inc., PO Box 194, Stow MA 01775-0194
fYear :
1996
fDate :
9-11 Sept. 1996
Firstpage :
839
Lastpage :
846
Keywords :
Conductive films; Current density; Electromigration; Electrons; Equations; Metals industry; Solid state circuits; Thin film circuits; Thin film transistors; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Conference_Location :
Bologna, Italy
Print_ISBN :
286332196X
Type :
conf
Filename :
5435971
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1924562
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