Title :
10 kV IGBT press pack modules with series connected chips
Author :
Kaufmann, Stefan ; Zwick, Fabian
Author_Institution :
Semicond., ABB Switzerland Ltd., Lenzburg, Switzerland
Abstract :
A package design for a 10 kV IGBT press pack module with series connected chips was developed. IGBT press pack modules with internal series or antiseries connection are offering new opportunities and potential cost savings in different applications. The proposed package design is presented for both series as well as antiseries connection. The main technical challenges, such as current management, thermal management, pressure management and high voltage management are described and their solutions are discussed. With such a package, a higher level of integration can be reached.
Keywords :
high-voltage techniques; insulated gate bipolar transistors; modules; power bipolar transistors; semiconductor device packaging; thermal management (packaging); 10 kV; IGBT press pack modules; cost savings; current management; high integration level package; high voltage management; internal antiseries connections; internal series connections; package design; pressure management; series connected chips; thermal management; Costs; Energy management; Insulated gate bipolar transistors; Matrix converters; Power system management; Semiconductor device packaging; Semiconductor devices; Switches; Thermal management; Voltage;
Conference_Titel :
Power Semiconductor Devices and ICs, 2002. Proceedings of the 14th International Symposium on
Print_ISBN :
0-7803-7318-9
DOI :
10.1109/ISPSD.2002.1016178
