DocumentCode :
1925619
Title :
The Vibration and Control of Multi-Wire Saw
Author :
Cheng, Zhi-Hua ; Xu, Chang-Kai ; Pei, Ren-Qing
Author_Institution :
Shanghai Univ., Shanghai
Volume :
2
fYear :
2007
fDate :
19-22 Aug. 2007
Firstpage :
735
Lastpage :
738
Abstract :
Starting from effects on machining quality that vibration acts on silicon wafer, we know the importance of the control of wire-vibration in wafer cutting. Based the analysis of the system, the paper builds up Hamiltom principle system models, and analyzes it with the finite element method. Different parameters on the natural frequency results are given. Finally, this paper presents the active control of wire-vibration and the fuzzy control. The paper gives the general setting about the system parameters and reaches anticipated results.
Keywords :
finite element analysis; fuzzy control; machining; semiconductor device manufacture; silicon; vibration control; wafer-scale integration; wires; Hamiltom principle system models; finite element method; fuzzy control; machining quality; multiwire saw control; multiwire saw vibration; silicon wafer; wafer cutting; wire-vibration active control; Cybernetics; Frequency; Machine learning; Rough surfaces; Sawing; Silicon; Slurries; Surface roughness; Vibration control; Wire; Hamiltom principle; Tension; Vibration; the finite element;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Machine Learning and Cybernetics, 2007 International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-0973-0
Electronic_ISBN :
978-1-4244-0973-0
Type :
conf
DOI :
10.1109/ICMLC.2007.4370241
Filename :
4370241
Link To Document :
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