The Vibration and Control of Multi-Wire Saw

Author

Cheng, Zhi-Hua ; Xu, Chang-Kai ; Pei, Ren-Qing

Author_Institution

Shanghai Univ., Shanghai

Volume

2

fYear

2007

fDate

19-22 Aug. 2007

Firstpage

735

Lastpage

738

Abstract

Starting from effects on machining quality that vibration acts on silicon wafer, we know the importance of the control of wire-vibration in wafer cutting. Based the analysis of the system, the paper builds up Hamiltom principle system models, and analyzes it with the finite element method. Different parameters on the natural frequency results are given. Finally, this paper presents the active control of wire-vibration and the fuzzy control. The paper gives the general setting about the system parameters and reaches anticipated results.

Keywords

finite element analysis; fuzzy control; machining; semiconductor device manufacture; silicon; vibration control; wafer-scale integration; wires; Hamiltom principle system models; finite element method; fuzzy control; machining quality; multiwire saw control; multiwire saw vibration; silicon wafer; wafer cutting; wire-vibration active control; Cybernetics; Frequency; Machine learning; Rough surfaces; Sawing; Silicon; Slurries; Surface roughness; Vibration control; Wire; Hamiltom principle; Tension; Vibration; the finite element;

fLanguage

English

Publisher

ieee

Conference_Titel

Machine Learning and Cybernetics, 2007 International Conference on

Conference_Location

Hong Kong

Print_ISBN

978-1-4244-0973-0

Electronic_ISBN

978-1-4244-0973-0

Type

conf

DOI

10.1109/ICMLC.2007.4370241

Filename

4370241