• DocumentCode
    1925895
  • Title

    Measurement-based extrinsic modeling of RF components

  • Author

    Naishadham, K.

  • Author_Institution
    RF Eng. R&D, Philips Broadband Networks, Manlius, NY, USA
  • Volume
    2
  • fYear
    2001
  • fDate
    20-24 May 2001
  • Firstpage
    1281
  • Abstract
    An understanding of the high-frequency parasitic and packaging effects of passive surface-mounted devices (SMDs) is required for robust equivalent circuit modeling of the device. In this paper, we develop a CAD model for SMD inductors on a CPW layout, which incorporates the non-ideal behavior associated with frequency dispersion, board layout, component parasitics, and the device packaging. The equivalent circuit parameters are extracted in closed-form from an accurate measurement of the S-parameters of the board-mounted SMD inductor, without the necessity for cumbersome optimization procedures normally followed in RF circuit synthesis.
  • Keywords
    S-parameters; coplanar waveguides; equivalent circuits; inductors; packaging; printed circuit layout; surface mount technology; CAD model; CPW layout; RF components; S-parameters; SMD inductors; board layout; component parasitics; device packaging; equivalent circuit parameters; frequency dispersion; high-frequency parasitic effects; measurement-based extrinsic modeling; nonideal behavior; packaging effects; passive surface-mounted devices; robust equivalent circuit modeling; Circuit simulation; Circuit synthesis; Coplanar waveguides; Electromagnetic modeling; Equivalent circuits; Packaging; RF signals; Radio frequency; Scattering parameters; Thin film inductors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2001 IEEE MTT-S International
  • Conference_Location
    Phoenix, AZ, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-6538-0
  • Type

    conf

  • DOI
    10.1109/MWSYM.2001.967127
  • Filename
    967127