DocumentCode :
1925895
Title :
Measurement-based extrinsic modeling of RF components
Author :
Naishadham, K.
Author_Institution :
RF Eng. R&D, Philips Broadband Networks, Manlius, NY, USA
Volume :
2
fYear :
2001
fDate :
20-24 May 2001
Firstpage :
1281
Abstract :
An understanding of the high-frequency parasitic and packaging effects of passive surface-mounted devices (SMDs) is required for robust equivalent circuit modeling of the device. In this paper, we develop a CAD model for SMD inductors on a CPW layout, which incorporates the non-ideal behavior associated with frequency dispersion, board layout, component parasitics, and the device packaging. The equivalent circuit parameters are extracted in closed-form from an accurate measurement of the S-parameters of the board-mounted SMD inductor, without the necessity for cumbersome optimization procedures normally followed in RF circuit synthesis.
Keywords :
S-parameters; coplanar waveguides; equivalent circuits; inductors; packaging; printed circuit layout; surface mount technology; CAD model; CPW layout; RF components; S-parameters; SMD inductors; board layout; component parasitics; device packaging; equivalent circuit parameters; frequency dispersion; high-frequency parasitic effects; measurement-based extrinsic modeling; nonideal behavior; packaging effects; passive surface-mounted devices; robust equivalent circuit modeling; Circuit simulation; Circuit synthesis; Coplanar waveguides; Electromagnetic modeling; Equivalent circuits; Packaging; RF signals; Radio frequency; Scattering parameters; Thin film inductors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-6538-0
Type :
conf
DOI :
10.1109/MWSYM.2001.967127
Filename :
967127
Link To Document :
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