DocumentCode
1925912
Title
Implementation of low power MB-OFDM PHY baseband modem with parallel architecture
Author
Ramadoss, G. ; Prakash, Gl
Author_Institution
K.S. Rangasamy Coll. of Technol., Tiruchengode, India
fYear
2013
fDate
7-9 Jan. 2013
Firstpage
1
Lastpage
5
Abstract
The multi-band orthogonal frequency division multiplexing modem needs to process large amount of computations in short time for support of high data rates from 53 to 480 Mbps. In order to satisfy the performance requirement while reducing power consumption, a multi way parallel architecture has been proposed. In this paper introduced several novel optimization techniques for resource efficient implementation of the baseband modem which has 8-way, parallel architecture, such as new processing structures for a (de)interleaver and a packet synchronizer and a carrier frequency offset compensator. Also, we describe how to efficiently design several other components. The detailed analysis shows that our optimization techniques could reduce the gate count by 27.6% on average, while none of techniques degraded the overall system performance. With 0.18-μm CMOS process, the gate count and power consumption of entire baseband modem were about 474 kgates and 248 mW at 66 MHz.
Keywords
CMOS integrated circuits; OFDM modulation; low-power electronics; modems; optimisation; parallel architectures; radiofrequency integrated circuits; 8-way, parallel architecture; CMOS process; bit rate 53 Mbit/s to 480 Mbit/s; carrier frequency offset compensator; deinterleaver; frequency 66 MHz; gate count; low power MB-OFDM PRY baseband modem; multiband orthogonal frequency division multiplexing; multiway parallel architecture; optimization technique; packet synchronizer; power 248 mW; power consumption; resource efficient implementation; size 0.18 mum; Logic gates; Multiplexing; Radio frequency; Synchronization; TV; Baseband modem; multi-band orthogonal frequency-division multiplexing (MB-OFDM); parallel architecture; resource optimization; ultra wideband (UWB);
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Trends in VLSI, Embedded System, Nano Electronics and Telecommunication System (ICEVENT), 2013 International Conference on
Conference_Location
Tiruvannamalai
Print_ISBN
978-1-4673-5300-7
Type
conf
DOI
10.1109/ICEVENT.2013.6496541
Filename
6496541
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