Title :
Thermal analysis of a suspension with an IC-chip
Author :
Nomura, I. ; Takano, K. ; Sat, I.
Author_Institution :
TDK Corporation
Keywords :
Heat transfer; Power dissipation; Solid modeling; Temperature; Thermal stresses;
Conference_Titel :
Magnetics Conference, 1999. Digest of INTERMAG 99. 1999 IEEE International
Conference_Location :
Kyongju, Korea
Print_ISBN :
0-7803-5555-5
DOI :
10.1109/INTMAG.1999.837413
