DocumentCode :
1926385
Title :
Active pull-down protection for full substrate current isolation in smart power IC´s
Author :
Laine, J.P. ; Gonnard, O. ; Charitat, G. ; Bertolini, L. ; Peyre-Lavigne, A.
Author_Institution :
LAAS/CNRS, Toulouse, France
fYear :
2002
fDate :
2002
Firstpage :
273
Lastpage :
276
Abstract :
Substrate current injection, and particularly minority carrier injection, is one of the major causes for redesign in smart power technology. This substrate parasitic current induces unexpected failure system such as latch-up in CMOS circuitry or analog signal perturbation. In this paper, we propose an efficient and compact protection, called active pull-down protection, against this substrate current. It reduces by more than 8 decades the injected current level.
Keywords :
CMOS integrated circuits; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; isolation technology; minority carriers; power integrated circuits; protection; CMOS circuitry; active pull-down protection; analog signal perturbation; efficient compact protection; injected current level; latch-up; minority carrier injection; smart power IC; smart power redesign; substrate current; substrate current isolation; substrate parasitic current; unexpected failure system; Bipolar transistors; Bridge circuits; CMOS analog integrated circuits; CMOS technology; Isolation technology; Power integrated circuits; Power system protection; Semiconductor diodes; Substrates; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2002. Proceedings of the 14th International Symposium on
Print_ISBN :
0-7803-7318-9
Type :
conf
DOI :
10.1109/ISPSD.2002.1016224
Filename :
1016224
Link To Document :
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