Title :
Design trade-off for resonance reduction of multiple power planes in Super Ball Grid Array (SBGA) package
Author :
Kim, Gawon ; Lee, SeungJae ; Yu, Jiheon ; Misman, Ozgur ; Bae, KiCheol ; Kim, TaeKi ; Lee, Sangwoong ; Kim, JinYoung
Author_Institution :
Amkor Technol. Korea, Seoul, South Korea
Abstract :
In this paper, package co-design procedure with electrical simulation supported by Amkor Technology will be described and design trade-off for effective power/ground plane design in SBGA package will be discussed. Two models of SBGA design, which has five kinds of main and sub-main power nets, are compared using 3D electromagnetic (EM) simulation tool. By comparison of both design, inevitable design trade-off for effective multiple power planes will be presented and discussed from power integrity (PI) viewpoint. The revised SBGA package design was implemented and measured to analyze plane resonances in the impedance profile of each power/ground planes according to frequencies up to 10 GHz so that the simulated self-impedances can be compared with measured results.
Keywords :
ball grid arrays; electric impedance; design trade-off; electrical simulation; electromagnetic simulation tool; multiple power planes; package co-design procedure; resonance reduction; simulated self-impedances; super ball grid array package; Electronics packaging; Frequency measurement; Impedance; Power measurement; Resonant frequency; Silicon; Solid modeling;
Conference_Titel :
CPMT Symposium Japan, 2010 IEEE
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-7593-3
DOI :
10.1109/CPMTSYMPJ.2010.5679670
