Impulse response of on-chip power supply networks under varying conditions

This paper presents a method for modeling chip-package resonance using impulse response and for measuring waveforms under varying conditions. We evaluated chip-package resonance with the following variations in conditions: (i) with and without on-package capacitors; (ii) differing positions on the chip; (iii) differing points of observation outside the chip (probe points for the package capacitor and bypass capacitor on the printed circuit board); (iv) circuit activating ratios varying from 11% to 100%. The results suggest that a circuit equivalent to our test chip can be expressed as a single lumped circuit. The results also demonstrate the effectiveness of on-package capacitors in reducing extra anti-resonance.