DocumentCode :
1928234
Title :
Thermal Fatigue Life Prediction Of Solder Joints Using Stress Analysis
Author :
Mukai, M. ; Kawakami, Tomoya
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
204
Lastpage :
208
Keywords :
Capacitive sensors; Creep; Electronic packaging thermal management; Electronics packaging; Fatigue; Life estimation; Printed circuits; Soldering; Temperature; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619005
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1928234
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