DocumentCode
1928234
Title
Thermal Fatigue Life Prediction Of Solder Joints Using Stress Analysis
Author
Mukai, M. ; Kawakami, Tomoya
fYear
1997
fDate
16-18 April 1997
Firstpage
204
Lastpage
208
Keywords
Capacitive sensors; Creep; Electronic packaging thermal management; Electronics packaging; Fatigue; Life estimation; Printed circuits; Soldering; Temperature; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619005
Link To Document