RF-microwave multi-layer integrated passives using fully organic System on Package (SOP) technology

Author

Davis, M.F. ; Sutono, A. ; Lim, K. ; Laskar, J. ; Sundaram, V. ; Hobbs, J. ; White, G.E. ; Tummala, R.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

3

fYear

2001

fDate

20-24 May 2001

Firstpage

1731

Abstract

This paper presents high-density, fully organic multi-layer interconnects and integrated passives for RF and microwave System on Package (SOP) development. The components developed in this technology include novel CPW-microstrip transitions, high Q passives, as well as a planar antenna on a package. High Q passives, designed to be implemented using the featured CPW-microstrip transitions in this organic multi-layer technology, demonstrate the feasibility of implementing SOP technology for RF and microwave applications. This technology also employs a lifted slot antenna with vertical feed to reduce loss at the feeding point and to minimize pattern distortion.

Keywords

Q-factor; UHF integrated circuits; coplanar waveguides; inductors; integrated circuit interconnections; integrated circuit packaging; microwave integrated circuits; multichip modules; slot antennas; waveguide transitions; CPW-microstrip transitions; RF applications; fully organic SOP technology; high Q passives; high-density multilayer interconnects; lifted slot antenna; microwave applications; multilayer integrated passives; organic system on package technology; planar antenna on package; vertical feed; Antenna feeds; Costs; Dielectric substrates; Inductors; Integrated circuit interconnections; Microwave technology; Organic materials; Packaging; Radio frequency; Slot antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2001 IEEE MTT-S International

Conference_Location

Phoenix, AZ, USA

ISSN

0149-645X

Print_ISBN

0-7803-6538-0

Type

conf

DOI

10.1109/MWSYM.2001.967240

Filename

967240