DocumentCode
1929095
Title
Incorporating computer aided device and process simulation tools in undergraduate courses
Author
Johnson, Carolyne ; Ula, Nazmul
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Loyola Marymount Univ., Los Angeles, CA, USA
Volume
1
fYear
1996
fDate
6-9 Nov 1996
Firstpage
27
Abstract
Semiconductor device design and fabrication are specialized fields in electrical engineering for which computer aided design (CAD) tools are becoming available. Normally, the design process is lengthy and costly, with many iterations required to achieve a successful product. CAD tools can reduce the time requirement and improve the overall yield. Its use has revolutionized the electronics industry and should be used to improve engineering education. Students would be exposed to design procedures and would be able to reinforce their understanding of electronic devices by participating in the device design process. This could be done by incorporating these topics into lectures, homework, lab assignments, and in semester long design projects which would give the student the opportunity to learn practical details of semiconductor device design and fabrication and in combination with background theory, achieve the balance of education, application and experience
Keywords
CAD/CAM; circuit CAD; computer aided instruction; digital simulation; electrical engineering computing; electrical engineering education; semiconductor device manufacture; CAD tools; computer aided design; computer aided device simulation; device design process; electrical engineering; electronics industry; engineering education; homework; lab assignments; lectures; process simulation tools; semiconductor device design; semiconductor device fabrication; time requirement; undergraduate courses; Circuit simulation; Computational modeling; Computer simulation; Costs; Design automation; Electrical engineering; Fabrication; Laboratories; Process design; Semiconductor devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Frontiers in Education Conference, 1996. FIE '96. 26th Annual Conference., Proceedings of
Conference_Location
Salt Lake City, UT
ISSN
0190-5848
Print_ISBN
0-7803-3348-9
Type
conf
DOI
10.1109/FIE.1996.567980
Filename
567980
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