Title :
Incorporating computer aided device and process simulation tools in undergraduate courses
Author :
Johnson, Carolyne ; Ula, Nazmul
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Loyola Marymount Univ., Los Angeles, CA, USA
Abstract :
Semiconductor device design and fabrication are specialized fields in electrical engineering for which computer aided design (CAD) tools are becoming available. Normally, the design process is lengthy and costly, with many iterations required to achieve a successful product. CAD tools can reduce the time requirement and improve the overall yield. Its use has revolutionized the electronics industry and should be used to improve engineering education. Students would be exposed to design procedures and would be able to reinforce their understanding of electronic devices by participating in the device design process. This could be done by incorporating these topics into lectures, homework, lab assignments, and in semester long design projects which would give the student the opportunity to learn practical details of semiconductor device design and fabrication and in combination with background theory, achieve the balance of education, application and experience
Keywords :
CAD/CAM; circuit CAD; computer aided instruction; digital simulation; electrical engineering computing; electrical engineering education; semiconductor device manufacture; CAD tools; computer aided design; computer aided device simulation; device design process; electrical engineering; electronics industry; engineering education; homework; lab assignments; lectures; process simulation tools; semiconductor device design; semiconductor device fabrication; time requirement; undergraduate courses; Circuit simulation; Computational modeling; Computer simulation; Costs; Design automation; Electrical engineering; Fabrication; Laboratories; Process design; Semiconductor devices;
Conference_Titel :
Frontiers in Education Conference, 1996. FIE '96. 26th Annual Conference., Proceedings of
Conference_Location :
Salt Lake City, UT
Print_ISBN :
0-7803-3348-9
DOI :
10.1109/FIE.1996.567980