Title :
Design and analysis of low cost IC package solution for 10 Gbit/s applications
Author :
Megahed, M. ; Zilaro, P. ; Khaw, M.
Author_Institution :
Conexant Syst. Inc., Newport Beach, CA, USA
Abstract :
Low cost IC package solution for 10 Gbit/s applications will be presented. The RF-LGA, laminate based CSP will be used. Design and analysis, in the frequency and time domains, of the RF-LGA is demonstrated. Results show that RF-LGA package, with wirebond technology, could achieve the required electrical performance for 10 Gbit/s applications.
Keywords :
chip scale packaging; frequency-domain analysis; laminates; lead bonding; time-domain analysis; 10 Gbit/s; RF-LGA; electrical performance; frequency domain; laminate based CSP; land grid array; low cost IC package solution; time domain; wirebond technology; Application specific integrated circuits; Bonding; Chip scale packaging; Costs; Frequency domain analysis; Impedance; Integrated circuit packaging; Laminates; Plastics; Time domain analysis;
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6538-0
DOI :
10.1109/MWSYM.2001.967279
