Title :
Coupled TLM-thermal analysis in the time domain
Author :
Wei Liu ; So, P.P.M. ; Hoefer, W.J.R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
Abstract :
A coupled time domain TLM-thermal analysis technique is presented in this paper. It is a hybrid combination of algorithms comprising TLM, FDTD and ray optical algorithms for evaluating the transient thermal behavior of objects placed inside a cavity or waveguide. Electromagnetic fields are calculated using a GSCN 3D TLM algorithm. We have developed the analysis procedure primarily for evaluating power handling capability of waveguide and microstrip structures. Nevertheless, this procedure can be applied to general microwave heating problems.
Keywords :
electromagnetic fields; microwave heating; ray tracing; thermal analysis; time-domain analysis; transmission line matrix methods; GSCN 3D TLM algorithm; analysis procedure; coupled TLM-thermal analysis; electromagnetic fields; microwave heating problems; power handling capability; ray optical algorithms; time domain; transient thermal behavior; Conductors; Electromagnetic heating; Electromagnetic waveguides; Finite difference methods; Heat transfer; Microwave ovens; Optical surface waves; Optical waveguides; Surface waves; Time domain analysis;
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-7803-6538-0
DOI :
10.1109/MWSYM.2001.967313
