DocumentCode
1930327
Title
Lumped and distributed device embedding techniques in time domain TLM field models
Author
Park, J.W. ; So, P.P.M. ; Hoefer, W.J.R.
Author_Institution
Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
Volume
3
fYear
2001
fDate
20-24 May 2001
Firstpage
2047
Abstract
There exist several techniques for embedding devices into TLM networks. These techniques yield in general slightly different results when the mesh size is finite. In this paper, we classify these techniques, compare results obtained with different embedding methods, and show how SPICE models of active and passive lumped element circuits can be incorporated into 2D and 3D TLM networks. Recommendations as to the best method for a given device type will be formulated.
Keywords
SPICE; electromagnetic fields; mesh generation; time-domain analysis; transmission line matrix methods; waveguide theory; 2D TLM networks; 3D TLM networks; SPICE models; device embedding techniques; lumped element circuits; mesh size; time domain TLM field models; Circuits; Computational electromagnetics; Concurrent computing; Electromagnetic waveguides; Frequency; Joining processes; Resistors; SPICE; Scattering parameters; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location
Phoenix, AZ, USA
ISSN
0149-645X
Print_ISBN
0-7803-6538-0
Type
conf
DOI
10.1109/MWSYM.2001.967314
Filename
967314
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