DocumentCode

1930535

Title

The Ideal Solderable Copper Protective Silver Coatlng For PCB

Author

Enomoto, Takao ; Tsunoda, Mutsuharu

fYear

1997

fDate

16-18 April 1997

Firstpage

254

Lastpage

257

Keywords

Assembly; Bonding; Coatings; Copper; Lead; Printed circuits; Protection; Silver; Surface topography; Surface treatment;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619015