Title :
Gold and Copper Ball Bond Shear Stress Comparison At Different Shear Tool Heights
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Norhaimi, Wan M W ; Taniselass, Steven ; Ong, Tee S. ; Vairavan, Rajendaran
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Pauh Putra Perlis, Malaysia
Abstract :
The reliability of wire bond is very significant due to its function of providing interconnection and signal passage to the integrated circuit. Wire bond shear test are utilized to evaluate the reliability and bond strength of bonded wires. In this study, the wire bond shear test is simulated. The effects of shear tool height on the stress response of bonded wires are examined through simulation. Ansys version 11 was utilized for the simulation. The stress response of two wire materials, gold(Au) and copper(Cu) at varied shear tool height during the wire bond shear test were evaluated.A 3D non-linear finite element model was developed for the simulation. The shear tool height of 0.29μm and 8.71μm were employed in this study.The simulation results shows that shear tool height has a significant effects on the stress response of bonded wires.
Keywords :
copper; finite element analysis; gold; integrated circuit interconnections; lead bonding; wires (electric); Au; Cu; bonded wire; copper ball bond shear stress; gold ball bond shear stress; interconnection technique; shear tool height; stress response; three dimensional nonlinear finite element model; wire bond shear test; wire material; Copper; Finite element methods; Gold; Materials; Solid modeling; Stress; Wires; Wirebond; shear test;
Conference_Titel :
Computational Intelligence, Modelling and Simulation (CIMSiM), 2012 Fourth International Conference on
Conference_Location :
Kuantan
Print_ISBN :
978-1-4673-3113-5
DOI :
10.1109/CIMSim.2012.84
