Title :
Laser-Induced Forward Transfer-assisted flip-chip bonding of optoelectronic components
Author :
Kaur, Kamalpreet S. ; Missinne, Jeroen ; Vandecasteele, B. ; Van Steenberge, Geert ; Perinchery, S.M. ; Smits, Edsger C. P. ; Mandamparabil, R.
Author_Institution :
Centre for Microsyst. Technol., IMEC/Ghent Univ., Ghent, Belgium
Abstract :
In this paper, the first results of Laser-Induced Forward Transfer (LIFT)-assisted printing of micro-bumps of non-flux based silver nanoparticle (AgNP) and flux-based solder pastes for flip-chip bonding of optoeletronic components were reported . The successful demonstration of chip-bumping and bonding with AgNP and solder pastes using LIFT shows the great potential of the technique for flip-chip interconnect technology especially for applications requiring fine pitch and high accuracy.
Keywords :
bonding processes; flip-chip devices; laser materials processing; nanoparticles; nanophotonics; optoelectronic devices; silver; Ag; chip-bumping; flip-chip bonding; flip-chip interconnect technology; flux-based solder pastes; laser-induced forward transfer; microbumps; nonflux based silver nanoparticle; optoeletronic components; Bonding; Flip-chip devices; Receivers; Substrates; Vertical cavity surface emitting lasers;
Conference_Titel :
Lasers and Electro-Optics Europe (CLEO EUROPE/IQEC), 2013 Conference on and International Quantum Electronics Conference
Conference_Location :
Munich
Print_ISBN :
978-1-4799-0593-5
DOI :
10.1109/CLEOE-IQEC.2013.6801589
