DocumentCode
1931794
Title
Pad Rerouting Technology
Author
Matsuki, Hirohisa ; Watanabe, Eiji ; Kado, Kenichi ; Fujimori, Jouji ; Mizukoshi, Masataka ; Kawahara, Toshimi ; Kasai, Junichi
fYear
1997
fDate
16-18 April 1997
Firstpage
275
Lastpage
279
Keywords
Atherosclerosis; Chromium; Conducting materials; Costs; Inorganic materials; Packaging; Polyimides; Resists; Sputtering; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619020
Link To Document