Galvanic isolation for high frequency applications using an integrated dielectric structure

Multi-layer dielectric devices used for isolated power transfer and suitable for high frequency power applications (>100kHz) are proposed. Such devices were realized based on a four terminal multi-layer ceramic structure with barium strontium titanate and alumina layers. Some key advantages of these devices are a reduction in losses over conventional decoupling techniques and ease of manufacturing due to the planar design. The paper focuses on the design details, characterization and performance of the Multi-Layer Capacitive Isolation Devices (MLCIDs).