DocumentCode :
1932435
Title :
Gate oxide integrity and hot-carrier degradation of TaSi2P+ polycide gate MOSFETs
Author :
Schwalke, U. ; Hansch, W. ; Kerber, M. ; Lill, A. ; Neppl, F.
Author_Institution :
Siemens AG, Corporate Research and Development, Otto-Hahn-Ring 6, D-8000 Munich 83, FR Germany; IBM, Essex-Junction, VT 05452, USA
fYear :
1990
fDate :
10-13 Sept. 1990
Firstpage :
299
Lastpage :
302
Abstract :
In this contribution we report on boron doped TaSi2/polySi gates which provide low sheet resistance, the appropriate p+ workfunction and simultaneously suppress boron-penetration effects. Gate oxide integrity, hot-carrier degradation and performance of TaSi2 p+ polycide NMOS and PMOS FETs are evaluated and compared to equivalent n+ polySi gate reference transistors.
Keywords :
Annealing; Boron; CMOS technology; Degradation; FETs; Hot carriers; Hydrogen; MOS devices; MOSFETs; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
Conference_Location :
Nottingham, England
Print_ISBN :
0750300655
Type :
conf
Filename :
5436354
Link To Document :
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