DocumentCode :
1932555
Title :
Plastic Packaging Consortium Plastic Package Thermal Dissipation
Author :
Tracy, Daniel ; Nguyen, Luu ; Glberti, R. ; Gallo, Anthony ; Bischo, C. ; Jonczrrk, C.J. ; Wohlin, J.
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
290
Lastpage :
294
Keywords :
Aluminum nitride; Assembly; Chemical technology; Costs; Electronic packaging thermal management; Electronics packaging; Plastic packaging; Silicon compounds; Thermal conductivity; Thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619023
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1932555
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