DocumentCode
1932555
Title
Plastic Packaging Consortium Plastic Package Thermal Dissipation
Author
Tracy, Daniel ; Nguyen, Luu ; Glberti, R. ; Gallo, Anthony ; Bischo, C. ; Jonczrrk, C.J. ; Wohlin, J.
fYear
1997
fDate
16-18 April 1997
Firstpage
290
Lastpage
294
Keywords
Aluminum nitride; Assembly; Chemical technology; Costs; Electronic packaging thermal management; Electronics packaging; Plastic packaging; Silicon compounds; Thermal conductivity; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location
IEEE
Print_ISBN
0-7803-4235-6
Type
conf
Filename
619023
Link To Document