Title :
Designing the thin-film resistors of hybrid integral schemes optimum on warm-up mode
Author :
Panichev, Artem V.
Author_Institution :
Novosibirsk State Tech. Univ., Russia
Abstract :
On the basis of an electrothermal analogy, analytical correlations were determined for the resulting temperature in any spot on a thin-film resistor depending on the desksides of the resistor, diffusing power level and substrate parameters. Conditions were found for the choice of the optimum resistor desksides, ensuring the most even sharing of temperature on its surfaces.
Keywords :
hybrid integrated circuits; optimisation; temperature distribution; thermal analysis; thermal diffusion; thermal management (packaging); thin film resistors; electrothermal analogy; even surface temperature sharing; hybrid integral schemes; resistor desksides; thermal diffusion; thin-film resistors; warm-up mode optimized resistors; Ceramics; Electric potential; Joining processes; Mirrors; Resistance heating; Resistors; Substrates; Surface resistance; Temperature dependence; Transistors;
Conference_Titel :
Electron Devices and Materials, 2003. Proceedings. 4th Annual 2003 Siberian Russian Workshop on
Print_ISBN :
5-7782-0412-4
DOI :
10.1109/SREDM.2003.1224189
