• DocumentCode
    1932758
  • Title

    Dry etching trends in flat panel display processing

  • Author

    Yao, W.W.

  • Author_Institution
    Xerox Palo Alto Res. Center, CA, USA
  • fYear
    1997
  • fDate
    19-22 May 1997
  • Firstpage
    314
  • Lastpage
    315
  • Abstract
    Summary form only given, as follows. Active Matrix Liquid Crystal Display (AMLCD) market is projected to quadruple in size by the next millennium. Within the last year, the flat panel display (FPD) marketplace has been very dynamic and the product requirements are evolving rapidly towards larger size, higher resolution, lower power consumption and at ever lower price targets. These market forces are driving FPD process technology innovations at a breathtaking pace. For FPD processing, dry etching is in an analogous position to that in IC processing back in the early 80s when the industry was posed to make the transition from wet to dry etch. Up to now, dry etching has only seen widespread manufacturing applications in Si and SiN processing. Within the last year, both Applied Komatsu Technology (AKT) and Lam Research (LRC) have introduced next generation FPD dry etch cluster tools. These tools offer improved process characteristics and enhanced capability that present many new opportunities to apply dry etching to FPD processing. In the next couple of years, dry etching will be a key enabler for architectural innovation. In the paper, these new dry etch processes and their applications in FPD display are reviewed.
  • Keywords
    etching; flat panel displays; liquid crystal displays; Applied Komatsu Technology; IC processing; Lam Research; Si processing; SiN processing; active matrix liquid crystal display; architectural innovation; dry etch cluster tools; dry etching; dry etching trends; enhanced capability; flat panel display marketplace; flat panel display processing; market forces; process characteristics; product requirements; review; widespread manufacturing applications; Active matrix liquid crystal displays; Analog integrated circuits; Dry etching; Energy consumption; Flat panel displays; Manufacturing industries; Manufacturing processes; Silicon compounds; Technological innovation; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1997. IEEE Conference Record - Abstracts., 1997 IEEE International Conference on
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-3990-8
  • Type

    conf

  • DOI
    10.1109/PLASMA.1997.605150
  • Filename
    605150