Title :
Study on E-business logistics system based on SOA
Author :
Juan, Yao ; Hongxia, Wang
Author_Institution :
Sch. of Inf. Sci., Nanjing Audit Univ., Nanjing, China
Abstract :
SOA is a new kind of architecture design for system development. It can solve heterogeneous problem by decomposing software services module and integrating service module. Traditional logistics information system has poor scalability and reusability, it is easy to form information islands. E-business logistics information system based SOA provide an ideal framework for design and implementation of logistics information system. In this paper we first discusses the framework of E-business logistics system based SOA, the whole system is composed by basic network layer, logistics resources layer, services support layer, business integration layer and E-business layer from the top to the bottom.Confirm that services support layer is crucial in the framework. We mainly consider the construction of service model when we study the service support layer,and gives the idea of service model tree. Proposed service modeling method by core of the data manipulation, determine the service model´s core technology, data entities and data manipulation correlation matrix. On the basis of analysis and design of framework, discusse the interface problems of the interface standard, granularity, and loosely coupled. Finally, discusse the key techniques in SOA.
Keywords :
data analysis; electronic commerce; logistics data processing; software architecture; software reliability; software reusability; SOA; correlation matrix; data entity; data manipulation; e-business logistic system; service oriented architecture; software reusability; software service; Biological system modeling; Educational institutions; Logistics; Semiconductor optical amplifiers; Service oriented architecture; Simple object access protocol; XML; data entity; data manipulation; granularit; service oriented architecture;
Conference_Titel :
Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5537-9
DOI :
10.1109/ICCSIT.2010.5563793