DocumentCode :
1933087
Title :
Fine Pitch High Pin Count AIN LGga Package
Author :
Asai, Hironori ; Kudo, Juri-ichi ; Yano, Kci-ichi ; Yasumoto, Taka-aki ; Kimura, Kazuo ; Iyogi, K. ; Moruna, J. ; Yamaguchi, Hitoshi ; Iwasc, Nobuo
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
299
Lastpage :
302
Keywords :
Area measurement; Capacitors; Costs; Flip chip; Inorganic materials; Lapping; Packaging; Semiconductor device measurement; Shape measurement; Sockets;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619025
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1933087
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