Title :
Thermal Shock Reliability Analysis Of Insulated Metal Substrates(IMS)
Author :
Yonemura, Naomi ; Fukuda, Makoto ; Shigi, Tadasuke
Keywords :
Conducting materials; Conductors; Copper; Electric shock; Insulation; Performance analysis; Silicon; Temperature; Thermal expansion; Thermal stresses;
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
