DocumentCode

1933597

Title

Insulation Reliability Of Fine Pitch Copper Paste Filled Via Holes

Author

Kawahara, Takeo ; Okamoto, Tomomi ; Furugori, Yuko

fYear

1997

fDate

16-18 April 1997

Firstpage

308

Lastpage

311

Keywords

Circuit testing; Copper; Dielectrics; Humidity; Insulation testing; Powders; Printed circuits; Printing; Silver; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

conf

Filename

619027