DocumentCode :
1933755
Title :
A parametric investigation of the reactive ion etching of InP in CH4/H2 plasmas using response surface methodology
Author :
Thomas, D J ; Clements, S J
Author_Institution :
STC Technology Ltd, London Road, Harlow, Essex, CM17 9NA
fYear :
1990
fDate :
10-13 Sept. 1990
Firstpage :
121
Lastpage :
124
Abstract :
Response surface methodology (RSM) is applied to study the reactive ion etching (RIE) of InP in CH4/H2 plasmas. Mechanistic information is inferred through careful interpretation of the contour plots derived from RSM. The data enable the process conditions required for specific device applications to be successfully selected.
Keywords :
Etching; Indium phosphide; Plasma applications; Plasma devices; Plasma materials processing; Plasma measurements; Polymers; Power measurement; Response surface methodology; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
Conference_Location :
Nottingham, England
Print_ISBN :
0750300655
Type :
conf
Filename :
5436411
Link To Document :
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