DocumentCode :
1933866
Title :
The Application Of Fem For Thick Film Material Design - The Development Of Low TCE Overglaze Paste To Improve Resistor Reliability
Author :
Nagasaka, Takashi ; Ootani, Y. ; Oka, Kengo
fYear :
1997
fDate :
16-18 April 1997
Firstpage :
312
Lastpage :
316
Keywords :
Conducting materials; Conductive films; Conductors; Dielectric substrates; Nonhomogeneous media; Research and development; Resistors; Temperature; Thermal resistance; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]
Conference_Location :
IEEE
Print_ISBN :
0-7803-4235-6
Type :
conf
Filename :
619028
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1933866
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