• DocumentCode
    1934045
  • Title

    SiGe devices and circuits: where are advantages over III/V ?

  • Author

    Konig, U. ; Gruhle, A. ; Schuppen, A.

  • Author_Institution
    Res. Center, Daimler-Benz AG, Ulm, Germany
  • fYear
    1995
  • fDate
    Oct. 29 1995-Nov. 1 1995
  • Firstpage
    14
  • Lastpage
    17
  • Abstract
    SiGe devices are just on an upswing due to their compatibility with existing silicon technologies. Outstanding SiGe ICs manufactured at high integration levels, high volume and low cost are envisaged. Concerning frequency they will fill the gap between standard Si and III/V. In some aspects like low-frequency and high-frequency noise, and low power consumption SiGe hetero bipolar transistors (HBTs) are advantageous over III/V-HBTs and approach the performance of some high electron mobility transistors (HEMTS), at least below 10 GHz. The paper reviews state of the art and potential of electronic SiGe heterodevices and tries a comparison to respective III/V devices.
  • Keywords
    Ge-Si alloys; semiconductor devices; semiconductor materials; III/V devices; SiGe; SiGe ICs; SiGe circuits; SiGe heterodevices; hetero bipolar transistors; high-frequency noise; low-frequency noise; power consumption; Circuits; Costs; Energy consumption; Frequency; Germanium silicon alloys; HEMTs; Low-frequency noise; MODFETs; Manufacturing; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1995. Technical Digest 1995., 17th Annual IEEE
  • Conference_Location
    San Diego, CA, USA
  • Print_ISBN
    0-7803-2966-X
  • Type

    conf

  • DOI
    10.1109/GAAS.1995.528952
  • Filename
    528952