DocumentCode
1934045
Title
SiGe devices and circuits: where are advantages over III/V ?
Author
Konig, U. ; Gruhle, A. ; Schuppen, A.
Author_Institution
Res. Center, Daimler-Benz AG, Ulm, Germany
fYear
1995
fDate
Oct. 29 1995-Nov. 1 1995
Firstpage
14
Lastpage
17
Abstract
SiGe devices are just on an upswing due to their compatibility with existing silicon technologies. Outstanding SiGe ICs manufactured at high integration levels, high volume and low cost are envisaged. Concerning frequency they will fill the gap between standard Si and III/V. In some aspects like low-frequency and high-frequency noise, and low power consumption SiGe hetero bipolar transistors (HBTs) are advantageous over III/V-HBTs and approach the performance of some high electron mobility transistors (HEMTS), at least below 10 GHz. The paper reviews state of the art and potential of electronic SiGe heterodevices and tries a comparison to respective III/V devices.
Keywords
Ge-Si alloys; semiconductor devices; semiconductor materials; III/V devices; SiGe; SiGe ICs; SiGe circuits; SiGe heterodevices; hetero bipolar transistors; high-frequency noise; low-frequency noise; power consumption; Circuits; Costs; Energy consumption; Frequency; Germanium silicon alloys; HEMTs; Low-frequency noise; MODFETs; Manufacturing; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1995. Technical Digest 1995., 17th Annual IEEE
Conference_Location
San Diego, CA, USA
Print_ISBN
0-7803-2966-X
Type
conf
DOI
10.1109/GAAS.1995.528952
Filename
528952
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