• DocumentCode
    1934635
  • Title

    Hydrogen related effects in semiconductor layers

  • Author

    Habraken, F.H.P.M. ; Arnoldbik, W.M. ; Brockhoff, A.M. ; Ullersma, E.H.C.

  • Author_Institution
    Dept.Interface Phys., Utrecht Univ., Netherlands
  • Volume
    2
  • fYear
    2001
  • fDate
    37165
  • Firstpage
    449
  • Abstract
    In low temperature processed amorphous silicon and its alloys like silicon nitride and carbide the presence and the behavior of hydrogen is of utmost importance for the applicability of these materials. Besides to beneficially passivate Si-dangling bond defects, hydrogen increases the reactivity of these materials and is a cause for instability. In this review we discuss examples of the study of the migration of single and molecular hydrogen inside the material as distinct steps in the process of effusion of H from the plasma deposited films. Also examples of the reverse process i.e. the uptake of hydrogen during a post deposition hydrogen treatment or during the deposition itself are presented. In these studies fruitfully use is made of (bi)layer structures in which hydrogenated and deuterated materials are spatially separated. We apply ~MeV ion beam techniques to measure concentration depth profiles of H and D. The high energy ion beams are also used to provoke molecule formation in the material, enabling in a novel manner the study of the permeability of thin films for H2 and D2 at relatively low temperature
  • Keywords
    amorphous semiconductors; dangling bonds; deuterium; effusion; elemental semiconductors; hydrogen; hydrogenation; impurity distribution; ion beam effects; passivation; permeability; plasma CVD coatings; semiconductor thin films; silicon; silicon compounds; Si:D; Si:H; SiC:D; SiC:H; SiN:D; SiN:H; amorphous semiconductor; amorphous silicon; bilayer structure; concentration depth profile; dangling bond defect; deuteration; effusion; hydrogen effects; hydrogenation; instability; ion beam technique; low temperature processing; migration; molecule formation; passivation; permeability; plasma deposited thin film; reactivity; silicon carbide; silicon nitride; Amorphous silicon; Bonding; Energy measurement; Hydrogen; Ion beams; Permeability measurement; Plasma materials processing; Plasma temperature; Semiconductor materials; Silicon alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 2001. CAS 2001 Proceedings. International
  • Conference_Location
    Sinaia
  • Print_ISBN
    0-7803-6666-2
  • Type

    conf

  • DOI
    10.1109/SMICND.2001.967504
  • Filename
    967504