DocumentCode :
1935135
Title :
Stacked CMOS Technology by Local Overgrowth (LOG)
Author :
Zingg, R.P. ; Hofflinger, B. ; Neudeck, G.W.
Author_Institution :
Institute for Microelectronics, D-7000 Stuttgart 80, FRG
fYear :
1989
fDate :
11-14 Sept. 1989
Firstpage :
877
Lastpage :
880
Abstract :
A new process is presented for building stacked CMOS transistors with high device quality. Device deterioration on bulk devices was minimized by reduced temperature processing for the SOI device, and the use of epitaxial lateral overgrowth to produce the silicon film for top devices improved film quality. The application of chemo-mechanical polishing allowed realization of 0.7¿m silicon films with better than 10% uniformity. NMOS transistors built in the bulk material exhibit 700cm2/Vs mobility and 105mV/dec subthreshold slope, while PMOS devices in the SOI film have surface mobilities of 165cm2Vs and a subthreshold slope of 109mV/dec. Threshold voltages are 0.5V and - 1.5V, respectively.
Keywords :
CMOS process; CMOS technology; Circuits; Dielectric substrates; Dielectrics and electrical insulation; Epitaxial growth; MOS devices; Semiconductor films; Silicon on insulator technology; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location :
Berlin, Germany
Print_ISBN :
0387510001
Type :
conf
Filename :
5436465
Link To Document :
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