Title :
Comparing of 2D and 3D modelling of MSM
Author :
Bulva, Jindrich ; Szendiuch, Ivan
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol., Czech Republic
Abstract :
This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices - FR4 and ceramic material Al 2O 3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and lead free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.
Keywords :
aluminium alloys; ceramics; eutectic alloys; solders; substrates; thermomechanical treatment; tin alloys; 2D modelling; 3D modelling; Al/sub 2/O/sub 3/; FR4-FR4; FR4-ceramic; MSM; SnAg; SnAgCu; ceramic material; ceramic-ceramic; eutectic SnPb solder; lead free solders; thermomechanical modelling; Ceramics; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Lead; Shape; Soldering; Substrates; Temperature; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Electron Devices, 2005 Spanish Conference on
Conference_Location :
Tarragona
Print_ISBN :
0-7803-8810-0
DOI :
10.1109/SCED.2005.1504485
