DocumentCode
1935163
Title
Comparing of 2D and 3D modelling of MSM
Author
Bulva, Jindrich ; Szendiuch, Ivan
Author_Institution
Dept. of Microelectron., Brno Univ. of Technol., Czech Republic
fYear
2005
fDate
2-4 Feb. 2005
Firstpage
473
Lastpage
475
Abstract
This article focuses on thermomechanical modelling of connection of two different materials, which are often used in electronic devices - FR4 and ceramic material Al 2O 3. There are investigated combinations FR4-FR4, FR4-ceramic, ceramic-ceramic, connected with eutectic SnPb solder and lead free solders (SnAg, SnAgCu). In the first step, 2D modelling was used. This approach is simpler for model creating and more unpretentious for computing time than 3D modelling, which is used after.
Keywords
aluminium alloys; ceramics; eutectic alloys; solders; substrates; thermomechanical treatment; tin alloys; 2D modelling; 3D modelling; Al/sub 2/O/sub 3/; FR4-FR4; FR4-ceramic; MSM; SnAg; SnAgCu; ceramic material; ceramic-ceramic; eutectic SnPb solder; lead free solders; thermomechanical modelling; Ceramics; Electronic packaging thermal management; Environmentally friendly manufacturing techniques; Lead; Shape; Soldering; Substrates; Temperature; Thermal stresses; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices, 2005 Spanish Conference on
Conference_Location
Tarragona
Print_ISBN
0-7803-8810-0
Type
conf
DOI
10.1109/SCED.2005.1504485
Filename
1504485
Link To Document